austriamicrosystems 0.8µm Design Documents

 

PROCESS PROCESS PARAMETERS DESIGN RULES
BiCMOS
BYB: 5V, BiCMOS, p-sub, 2-metal, 2-poly ²)
BYE: 5V, BiCMOS, p-sub, 2-metal, 2-poly
BYQ: 5V, BiCMOS, p-sub, 2-metal, 2-poly, hr-poly
0.8 µm BiCMOS Process Parameters
Document: ENG-124
Revision: 3.0
07/2002
0.8 µm BiCMOS Design Rules
Document: 9931016
Revision: 2.0
04/2002
CMOS
CXB: 5V, p-sub, 2-metal, 1-poly
CXE: 5V, p-sub, 2-metal, 2-poly
CXQ: 5V, p-sub, 2-metal, 2-poly, hr-poly
0.8 µm CXQ CMOS Process Parameters
Document: 9933013
Revision: C
08/1999
0.8 µm CXQ CMOS Design Rules
Document: 9931029
Revision: C
06/1999
CMOS HV
CXT: 50V, p-sub, 2-metal, 1-poly
CXY: 50V, p-sub, 2-metal, 2-poly
CXZ: 50V, p-sub, 2-metal, 2-poly, hr-poly
0.8 µm HV CMOS Process Parameters *
Document: 9933014
Revision: 2.0
04/2001

* Process Change Notification 05-2007

0.8 µm CXQ CMOS Design Rules
Document: 9931029
Revision: C
06/1999
and
0.8 µm HV CMOS Design Rules¹)
Document: 9931030
Revision: 2.0
04/2001

¹) This document is a supplement to the 0.8 µm CXQ CMOS Design Rules
²) BYB = BYE without poly-poly capacitors