Latest News on ASIC

19-Apr-2012: Meet us at GSA European Executive Forum & CDNLive! EMEA 2012

 

austriamicrosystems invites you to meet us at the GSA Executive forum and the CDNLive! EMEA 2012. austriamicrosystems' Full Service Foundry team will present its ...
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01-Mar-2012: HIT-Kit News

 

Welcome to the 37th edition of HIT-Kit NEWS our e-mail newsletter issued by the austriamicrosystems Full Service Foundry Business Unit containing news, facts and information to help you to get the best out of our design kits. In this edition you will find news about:
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15-Feb-2012: New Process Design Kit based on Cadence IC5.1.41 for 0.35µm (C35/H35/S35) CMOS Technologies available now!

The new HIT-Kit v3.80 includes high density silicon qualified libraries enabling significantly smaller die size along with performance improvements.
Press Release
hitkit380

30-Nov-2011: MPW Shuttle Service 2012

 

New Multi Product Wafer (MPW) Calendar and Price List 2012 available now!

Press Release
Multi Product Wafer (MPW) Calendar and Price List 2012

29-Nov-2011: Invitation to FREE Technical Seminar on Dec 8, 2011

 

austriamicrosystems is pleased to invite you to a complimentary half day Technical Seminar on December 8, 2011 in Santa Clara (CA) focusing on an introduction to austriamicrosystems' comprehensive service and technology package that goes beyond industry standard foundry services.
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07-Jun-2011: austriamicrosystems releases new versions of its best-in-class process design kit for 0.18µm High-Voltage CMOS technology

 

The new HIT-Kits v3.78 & v4.01 for H18 process include high density silicon qualified libraries enabling industry-first RF (Radio Frequency) integration and high density SoC (System on a Chip) capability
Press Release
hitkit378 based on Cadence IC5.1.41
hitkit401 based on Cadence IC6.1.4

30-Mar-2011: austriamicrosystems releases 0.18µm HV CMOS process for volume production

 

Featuring a new level of RF and HV integration capability on a single IC, the new 0.18µm High-Voltage CMOS process offers the highest integration density, up to 118k gates/mm2, enabling SoC applications (System-on-Chip) as well as best-in-class power-on resistance (Rdson) which directly results in a silicon area reduction.
Press Release

29-Nov-2010: Invitation to 0.18µm High-Voltage Technology Seminar on Dec 9, 2010

 

austriamicrosystems is pleased to announce a complimentary half day High-Voltage seminar on Dec 9, 2010 in Santa Clara (CA) focusing on High-Voltage design techniques with austriamicrosystems' and IBM's 0.18µm CMOS High-Voltage Processes.
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22-Nov-2010: MPW Shuttle Service 2011

 

New Multi Product Wafer (MPW) Calendar and Price List 2011 available now!

Press Release
Multi Product Wafer (MPW) Calendar and Price List 2011

24-Sep-2010: HIT-Kit News

 

Welcome to the 36th edition of HIT-Kit NEWS our e-mail newsletter issued by the austriamicrosystems Full Service Foundry Business Unit containing news, facts and information to help you to get the best out of our design kits. In this edition you will find news about:
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24-Jun-2010: austriamicrosystems releases new version of best-in-class process design kit for its 0.18µm High-Voltage CMOS technology

 

The new HIT-Kit v3.77 - H18 has been qualified for Cadence IC 5.1.41 USR6 (ISR2) and for the technologies

  • 0.18µm H18A4 (HV CMOS, 4-metal)
  • 0.18µm H18A5 (HV CMOS, 5-metal)
  • 0.18µm H18A6 (HV CMOS, 6-metal)
Read more details about this new HIT-Kit version:
Press Release
/hitkit377

24-Nov-2009: MPW Shuttle Service 2010

 

New Multi Product Wafer (MPW) Calendar and Price List 2010 available now!

Press Release
Multi Product Wafer (MPW) Calendar and Price List 2010

18-Nov-2009: HIT-Kit Updates available!

 

Please download all recent updates for all current HIT-Kit versions, which install the latest Assura run sets including DFM and a new context, that supports IC6.1.3 versions (for HIT-Kit v4.00) from our
Download Area

17-Sep-2009: Invitation to High-Voltage Technology Seminar on Sept 30, 2009

 

austriamicrosystems is pleased to announce a complimentary half day High-Voltage Workshop on September 30, 2009 in Santa Clara (CA) focusing on current best practices for implementing designs in 0.18µm High-Voltage CMOS technologies.
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17-Aug-2009: HIT-Kit News

 

Welcome to the 35th edition of HIT-Kit NEWS our e-mail newsletter issued by the austriamicrosystems Full Service Foundry Business Unit containing news, facts and information to help you to get the best out of our design kits. In this edition you will find news about:
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24-Jul-2009: HIT-Kit 3.70 Update for Calibre and S35 technology

 

Please download an update, which installs the latest run sets including DFM runsets for S35 technology from our Download Area

 

The name of the file is s35_calibre_digital_HK370_20090306_Calibre.tar.gz.des

22-Jun-2009: HIT-Kit 3.70 Update for Assura and S35 technology

 

Please download an update, which includes improvements for the extraction of PLDMOS devices. These new run sets are qualified for Assura 3.1.7 USR2 + EXT7.1 USR1 and are available on our  Download Area

 

The name of the file is s35_cadence_digital_HK370_20090608_Assura.tar.gz.des

 

Important Note:
This update also changes the parasitic extract flow: Be sure to enable the switch "resimulate_extracted" in LVS if you want to use that LVS run for RCX!

 

Please also carefully read the updated Assura documentation!

21-Apr-2009: Updated Documents available for download


Please download the new Rev.6 of the 0.35µm H35 50V CMOS Module Process Parameters
Please download the new Rev.7 of the 0.35µm H35 50V CMOS Module Design Rules

05-Dec-2008: MPW Shuttle Service 2009

 

New Multi Product Wafer (MPW) Calendar and Price List 2009 available now!

 

Read more:
Press Release
Multi Product Wafer (MPW) Calendar and Price List 2009

31-Oct-2008: Foundry News

 

Welcome to the 4th edition of Foundry NEWS in 2008, which is issued on a regular basis by the austriamicrosystems business unit Full Service Foundry. In this issue you will find news about:
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10-Oct-2008: HIT-Kit News

 

Welcome to the 34th edition of HIT-Kit NEWS our e-mail newsletter issued by the austriamicrosystems Full Service Foundry Business Unit containing news, facts and information to help you to get the best out of our design kits. In this edition you will find news about:
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11-Sep-2008: Invitation to High-Voltage Technology Seminar

 

austriamicrosystems is pleased to announce a complimentary half day High-Voltage Workshop on October 1, 2008 in Santa Clara (CA). This seminar focuses on current best practices for implementing designs on High-Voltage CMOS analog specialty technologies from specification to working system on silicon.
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11-Sep-2008: austriamicrosystems releases newest version of its best in class process design kit

 

The new HIT-Kit v4.00 combines new process add-ons with the support of the latest Cadence Virtuoso custom design platform IC 6.1.2 ISR10 and is available for the 0.35µm CMOS, High-Voltage CMOS and SiGe-BiCMOS specialty technologies.

 

Read more details about this new HIT-Kit version:
Press Release
/hitkit400

09-Jul-2008: Assura Runset and Flow Update in HIT-Kit 3.70 / 3.72

 

This update includes improved DRC, LVS and RCX run sets qualified for Assura 3.1.7 USR2 + EXT7.1USR1. The new runsets changes also the parasitic extract flow: Therefore be sure to enable the switch "resimulate_extracted" in LVS if you want to use that LVS run for RCX !!!!

 

Please also read the updated Assura documentation for HK 3.70 and HK 3.72
Download updates for HIT-Kit 3.70 and HIT-Kit 3.72

15-Feb-2008: Updated Document available for download


Please download Rev.5 of the 0.35µm C35 CMOS Noise Parameters Document

26-Nov-2007: MPW Shuttle Service 2008


New Multi Product Wafer (MPW) Calendar and Price List 2008 available now!

04-Oct-2007: HIT-Kit v3.72 for H35 process

 

There is a new HIT-Kit v3.72 available for Cadence IC 5.1.41, which comes complete with additional 20V devices and special utilities optimized for High-Voltage CMOS product design.

 

Release Notes
Press Release