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2011/11/30
MPW Shuttle Service 2012
New Multi Product Wafer (MPW) Calendar and Price List 2012 available now!
Press Release
Multi Product Wafer (MPW) Calendar and Price List 2012
MPW Shuttle Service 2012
New Multi Product Wafer (MPW) Calendar and Price List 2012 available now!
Press Release
Multi Product Wafer (MPW) Calendar and Price List 2012
2011/06/07
austriamicrosystems releases new versions of its best-in-class process design kit for 0.18µm High-Voltage CMOS technology
The new HIT-Kits v3.78 & v4.01 for H18 process include high density silicon qualified libraries enabling industry-first RF (Radio Frequency) integration and high density SoC (System on a Chip) capability
Press Release
hitkit378 based on Cadence IC5.1.41
hitkit401 based on Cadence IC6.1.4
austriamicrosystems releases new versions of its best-in-class process design kit for 0.18µm High-Voltage CMOS technology
The new HIT-Kits v3.78 & v4.01 for H18 process include high density silicon qualified libraries enabling industry-first RF (Radio Frequency) integration and high density SoC (System on a Chip) capability
Press Release
hitkit378 based on Cadence IC5.1.41
hitkit401 based on Cadence IC6.1.4
2011/03/30
austriamicrosystems releases 0.18µm High-Voltage CMOS process for volume production
Featuring a new level of RF and HV integration capability on a single IC, the new 0.18µm High-Voltage CMOS process offers the highest integration density, up to 118k gates/mm2, enabling SoC applications (System-on-Chip) as well as best-in-class power-on resistance (Rdson) which directly results in a silicon area reduction.
Press Release
austriamicrosystems releases 0.18µm High-Voltage CMOS process for volume production
Featuring a new level of RF and HV integration capability on a single IC, the new 0.18µm High-Voltage CMOS process offers the highest integration density, up to 118k gates/mm2, enabling SoC applications (System-on-Chip) as well as best-in-class power-on resistance (Rdson) which directly results in a silicon area reduction.
Press Release